International Journal of Circuits, Systems and Signal Processing

E-ISSN: 1998-4464
Volume 15, 2021

Notice: As of 2014 and for the forthcoming years, the publication frequency/periodicity of NAUN Journals is adapted to the 'continuously updated' model. What this means is that instead of being separated into issues, new papers will be added on a continuous basis, allowing a more regular flow and shorter publication times. The papers will appear in reverse order, therefore the most recent one will be on top.

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Volume 15, 2021

Title of the Paper: Universal Service Systems for Scalable Copper Packaging of Discrete Circuit Components


Authors: Shuh-Ping Sun, Jerry Hu

Pages: 1744-1750 

DOI: 10.46300/9106.2021.15.188     XML


Abstract: In the decade of digital electronics, no matter what type is, high-value, high-complexity, high-performance devices (such as the main microprocessor core in smart phones) is undoubtedly crucial. However, simple discrete circuit components (such as capacitors, resistors, diodes, transistors, etc.) are also essential for mobile phones. In order to continue to increase functionality and reliability, reduce size and power consumption, reduce costs, and any function we seek in electronic equipment, there is always the basic principle of squeezing everything onto the same semiconductor chip. However, in some unavoidable situations, not all circuit components can run on the same chip. This service system uses a copper substrate as the core material for packaging, and can package chips with high bonding density. It provides a universal service platform for packaged products called: Scalable Universal Copper-based Packaging (CopperPak) service system. This service system is attributed to copper-based packaging (CopperPak) as a solution for expansion packaging, which can package the chip on the multifunctional component as much as possible. Scalable universal copper-based packaging (CopperPak) service system, including miniature copper-based packaging (TyniCopk) and large-scale copper-based packaging (MassyCopk) modules, used to package discrete circuit components, not only solve the discrete circuit components size, heat transfer and positioning alignment issues, and simplify the packaging process and improve yield rate.