International Journal of Circuits, Systems and Signal Processing

   
E-ISSN: 1998-4464
Volume 15, 2021

Notice: As of 2014 and for the forthcoming years, the publication frequency/periodicity of NAUN Journals is adapted to the 'continuously updated' model. What this means is that instead of being separated into issues, new papers will be added on a continuous basis, allowing a more regular flow and shorter publication times. The papers will appear in reverse order, therefore the most recent one will be on top.

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Volume 15, 2021

Title of the Paper: Fault Coexistence and Grading Aware TSV Test based on Delay Feature

Authors: Chang Hao, Ni Tianming, Xu Yong, Li Feng, Liang Houjun, Li Yang

Pages: 623-633 

DOI: 10.46300/9106.2021.15.69     XML

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Abstract: Screening out the defects in the TSV manufacturing process and eliminating the resistive open fault and leakage fault as early as possible are beneficial to improve the yield and reliability of 3D ICs. The existing prebond test methods are confined to the test accuracy and de- tection range, especially the test confusion prob- lem and the lack of diagnosable ability under the coexistence of multiple faults. Based on the uc- tuation of delay feature caused by faults, a kind of fault coexistence and grading aware TSV test method is proposed to enhance the yield and reli- ability of TSVs in this paper. The reference TSV and the TSV under test are input with test stim- uli simultaneously. Furthermore, the designed delay extraction circuit is utilized to generate the rising edge and the falling edge separately and additional fault grading circuit can be enriched according to the test requirements. Finally, a one bit comparator at the capture end is used to detect whether two pulse signals arrive simul- taneously, so as to determine whether there is a fault and the type of fault. The simulation results indicate that the detection range of resistive open fault is more than 281 , and the detection range of leakage fault is less than 223 M , which is bet- ter than most existing methods. While effectively solving resistive open fault and leakage fault, it can also successfully deal with the coexistence of two kinds of faults and achieve a 5-level fault grading ability with relatively low area overhead.