International Journal of Applied Mathematics and Informatics

ISSN: 2074-1278
Volume 12, 2018

Notice: As of 2014 and for the forthcoming years, the publication frequency/periodicity of NAUN Journals is adapted to the 'continuously updated' model. What this means is that instead of being separated into issues, new papers will be added on a continuous basis, allowing a more regular flow and shorter publication times. The papers will appear in reverse order, therefore the most recent one will be on top.

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Volume 12, 2018

Title of the Paper: Multi-layer Thermal Analysis for VLSI Chips: A New Technique and its Mathematical Foundations


Authors: Keiji Nakabayashi

Pages: 1-13

Abstract: We present a new technique of multi-layer thermal analysis for VLSI chips. It performs two dimensional, steady-state analysis of thermal conduction and heat generation. Its key component is a new direct method of solving huge systems of linear equations derived from thermal conduction equations. We implemented our technique in C and compared its performance to that of the most effective iterative method of ICCG of LASPACK. Our experimental results demonstrate the superiority of our program by the factors of 3.25 and 6.4 while keeping smaller residuals by 5 and 1 order(s) of magnitude, respectively.